Amkor Technology, Inc. logo

Amkor Technology, Inc.

16 Live Marks
40 on record
Corp.
First Filed:Sep 14, 1981Latest Filed:Dec 23, 2021Address:2045 East Innovation Circle, Tempe, AZ 85284, US

Portfolio Overview

Top Classes

Class 9
Electronics, Software & Scientific Equipment
31(78%)
Class 40
Material Treatment
14(35%)
Class 42
Software, IT Services & Scientific Research
6(15%)

TTAB Proceedings

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Top Firms

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Trademark Activity Timeline(1981 – 2022)

Trademark Portfolio

40 results

(current & previous marks)

Refine by Mark/Description🔽
Filed
Registered
Last Activity
FLEXCSP
FLEXCSP
Trademark
Word
ABANDONED
Owner:
Serial:97187659
Filed:Dec 23, 2021
Classes:9, 40, 42
Description: Class 9: Semiconductor devices, namely, semiconductor packages comprised of semiconductor dies and interconnects
Class 40: Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others
Class 42: Design and testing of semiconductor devices for others
FLEXCSP
FLEXCSP
Trademark
Word
ABANDONED
Owner:
Serial:90033642
Filed:Jul 2, 2020
Classes:40
POWERCSP
POWERCSP
Trademark
Word
REGISTERED
Owner:
Serial:90033663
Filed:Jul 2, 2020
Classes:9, 40, 42
Registration:6901768
Registered:Nov 15, 2022
Description: Class 9: Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects
Class 40: Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others
Class 42: Design and testing of semiconductor devices for others
AMKOR
AMKOR
Trademark
Word
REGISTERED
Owner:
Serial:88225267
Filed:Dec 11, 2018
Classes:9, 40, 42
Registration:5819320
Registered:Jul 30, 2019
Description: Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects | Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others | Design and testing of semiconductor devices for others
SWIFT
SWIFT
Trademark
Word
REGISTERED
Owner:
Serial:86567869
Filed:Mar 18, 2015
Classes:9, 40
Registration:5161677
Registered:Mar 14, 2017
Description: Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects | Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others
POSSUM
POSSUM
Trademark
Word
REGISTERED
Owner:
Serial:85828340
Filed:Jan 21, 2013
Classes:9, 40
Registration:4724245
Registered:Apr 21, 2015
Description: Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects | Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others
TMV
TMV
Trademark
Word
REGISTERED
Owner:
Serial:77520548
Filed:Jul 11, 2008
Classes:9
Registration:3775559
Registered:Apr 13, 2010
Description: Semiconductor devices, namely, semiconductor packages comprised of semiconductor dies and interconnects
CIMITAR
CIMITAR
Trademark
Word
ABANDONED
Owner:
Serial:77375799
Filed:Jan 18, 2008
Classes:9
INTEGRATED PACKAGE ON PACKAGE
INTEGRATED PACKAGE ON PACKAGE
Trademark
Word
ABANDONED
Owner:
Serial:77092585
Filed:Jan 26, 2007
Classes:9
IPOP
IPOP
Service Mark
Stylized
ABANDONED
Owner:
Serial:77092584
Filed:Jan 26, 2007
Classes:40
FUSIONQUAD
FUSIONQUAD
Trademark
Word
REGISTERED
Owner:
Serial:77029465
Filed:Oct 25, 2006
Classes:9
Registration:3477228
Registered:Jul 29, 2008
Description: Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects
AMKOR
AMKOR
Trademark
Combined
REGISTERED
Owner:
Serial:77011979
Filed:Oct 2, 2006
Classes:9, 40
Registration:3573029
Registered:Feb 10, 2009
Description: Class 9: Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects
Class 40: Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others
FLIPSTACK
FLIPSTACK
Trademark
Word
REGISTERED
Owner:
Serial:77011981
Filed:Oct 2, 2006
Classes:9
Registration:3828622
Registered:Aug 3, 2010
Description: Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects
UNITIVE
UNITIVE
Service Mark
Combined
CANCELLED
Owner:
Serial:78559210
Filed:Feb 2, 2005
Classes:40
Registration:3058949
Registered:Feb 14, 2006
UNITIVE
UNITIVE
Service Mark
Word
CANCELLED
Owner:
Serial:78559156
Filed:Feb 2, 2005
Classes:40
Registration:3058948
Registered:Feb 14, 2006
AMKARD
AMKARD
Service Mark
Word
CANCELLED
Owner:
Serial:78316619
Filed:Oct 21, 2003
Classes:40
Registration:3006523
Registered:Oct 11, 2005
ENABLING A MICROELECTRONIC WORLD
ENABLING A MICROELECTRONIC WORLD
Service Mark
Word
CANCELLED
Owner:
Serial:76264759
Filed:May 29, 2001
Classes:42
Registration:2762388
Registered:Sep 9, 2003
Description: CUSTOM FABRICATION, PACKAGING, NAMELY, ENCAPSULATION AND ASSEMBLY OF SEMICONDUCTOR DEVICES FOR OTHERS; DESIGN OF PACKAGING FOR SEMICONDUCTOR DEVICES FOR OTHERS, AND TESTING OF SEMICONDUCTOR DEVICES
ETCSP
ETCSP
Trademark
Word
CANCELLED
Owner:
Serial:76145468
Filed:Oct 11, 2000
Classes:9
Registration:2743072
Registered:Jul 29, 2003
MLFLEX
MLFLEX
Trademark
Word
CANCELLED
Owner:
Serial:76145559
Filed:Oct 11, 2000
Classes:9
Registration:2762250
Registered:Sep 9, 2003
SCANPAK
SCANPAK
Trademark
Word
ABANDONED
Owner:
Serial:76145563
Filed:Oct 11, 2000
Classes:9
SENSORPAK
SENSORPAK
Trademark
Word
ABANDONED
Owner:
Serial:76145558
Filed:Oct 11, 2000
Classes:9
SHIELDPAK
SHIELDPAK
Trademark
Word
ABANDONED
Owner:
Serial:76145562
Filed:Oct 11, 2000
Classes:9
SNAPARRAY
SNAPARRAY
Trademark
Word
ABANDONED
Owner:
Serial:76145553
Filed:Oct 11, 2000
Classes:9
SUPERFC
SUPERFC
Trademark
Word
CANCELLED
Owner:
Serial:76145560
Filed:Oct 11, 2000
Classes:9
Registration:2743074
Registered:Jul 29, 2003
MLF
MLF
Trademark
Word
REGISTERED
Owner:
Serial:76107763
Filed:Aug 10, 2000
Classes:9
Registration:2737520
Registered:Jul 15, 2003
Description: SEMICONDUCTOR PACKAGING FOR USERS AND MANUFACTURERS OF SEMICONDUCTORS AND DEVICES UTILIZING SEMICONDUCTORS
CHIPARRAY
CHIPARRAY
Trademark
Word
REGISTERED
Owner:
Serial:75713578
Filed:May 26, 1999
Classes:9
Registration:2505797
Registered:Nov 13, 2001
Description: CERAMIC SUBSTRATE OR EPOXY LAMINATE SUBSTRATE WITH COPPER CIRCUIT TRACES IN ENCAPSULATED PLASTIC FOR PACKAGING INTEGRATED CIRCUITS AND TO CONNECT INTEGRATED CIRCUITS TO PRINTED CIRCUIT BOARDS
POWERSOP
POWERSOP
Trademark
Word
REGISTERED
Owner:
Serial:75714446
Filed:May 26, 1999
Classes:9
Registration:2528886
Registered:Jan 15, 2002
Description: SEMICONDUCTOR PACKAGING INCORPORATING HEAT DISSIPATION STRUCTURES
EPAD
EPAD
Trademark
Stylized
ABANDONED
Owner:
Serial:75585555
Filed:Nov 12, 1998
Classes:9
Description: PLASTIC INTEGRATED CIRCUIT PACKAGING WHICH INCORPORATES A DIE ATTACH PADDLE WHICH IS DEPRESSED SUCH THAT IT IS FLUSH WITH THE PACKAGE BOTTOM SURFACE FOR THERMAL AND ELECTRICAL ENHANCEMENT
EXPOSEDPAD
EXPOSEDPAD
Trademark
Word
ABANDONED
Owner:
Serial:75585554
Filed:Nov 12, 1998
Classes:9
Description: PLASTIC INTEGRATED CIRCUIT PACKAGING WHICH INCORPORATES A DIE ATTACH PADDLE WHICH IS DEPRESSED SUCH THAT IT IS FLUSH WITH THE PACKAGE BOTTOM SURFACE FOR THERMAL AND ELECTRICAL ENHANCEMENT
MICROLEADFRAME
MICROLEADFRAME
Trademark
Stylized
REGISTERED
Owner:
Serial:75577326
Filed:Oct 27, 1998
Classes:9
Registration:2764509
Registered:Sep 16, 2003
Description: Semiconductor packaging
TAPEARRAY
TAPEARRAY
Trademark
Word
CANCELLED
Owner:
Serial:75573579
Filed:Oct 19, 1998
Classes:9
Registration:2568521
Registered:May 7, 2002
Description: SEMICONDUCTOR PACKAGING, NAMELY, A POLYMIDE BASED SUBSTRATE BALL GRID ARRAY PACKAGE
WSCSP
WSCSP
Trademark
Word
ABANDONED
Owner:
Serial:75524067
Filed:Jul 23, 1998
Classes:9
Description: SEMICONDUCTOR PACKAGES
SILICON-PACKAGE ARCHITECTURE
SILICON-PACKAGE ARCHITECTURE
Service Mark
Word
ABANDONED
Owner:
Serial:75481441
Filed:May 7, 1998
Classes:35
Description: DESIGN CONSULTING SERVICES, EDA TOOLS, CAD TOOLS INTEGRATED CIRCUIT DESIGN ELEMENTS, PACKAGE DESIGN AND OTHER PRODUCTS AND SERVICES ASSOCIATED WITH SEMICONDUCTOR WAFER FABRICATION, PACKAGE, ASSEMBLY AND TEST
AMKOR TECHNOLOGY
AMKOR TECHNOLOGY
Trademark
Combined
REGISTERED
Owner:
Serial:75454796
Filed:Mar 23, 1998
Classes:9, 40, 42
Registration:2478315
Registered:Aug 14, 2001
Description: CUSTOM FABRICATION, PACKAGING, NAMELY, ENCAPSULATION AND ASSEMBLY OF SEMICONDUCTOR DEVICES FOR OTHERS; SEMICONDUCTOR PACKAGES; DESIGN OF PACKAGING FOR SEMICONDUCTOR DEVICES FOR OTHERS, AND TESTING OF SEMICONDUCTOR DEVICES
VISIONPAK
VISIONPAK
Trademark
Word
CANCELLED
Owner:
Serial:75428175
Filed:Feb 3, 1998
Classes:9
Registration:2393904
Registered:Oct 10, 2000
Description: INTEGRATED CIRCUITS USED WITH TOYS AND CAMERAS, INCLUDING SECURITY CAMERAS AND VIDEO CAMCORDERS
AMKOR TECHNOLOGY
AMKOR TECHNOLOGY
Trademark
Word
REGISTERED
Owner:
Serial:75417622
Filed:Jan 13, 1998
Classes:9, 40, 42
Registration:2478303
Registered:Aug 14, 2001
Description: CUSTOM FABRICATION; PACKAGING, NAMELY, ENCAPSULATION; AND ASSEMBLY OF SEMICONDUCTOR DEVICES FOR OTHERS; SEMICONDUCTOR PACKAGES; DESIGN OF PACKAGING FOR SEMICONDUCTOR DEVICES FOR OTHERS, AND TESTING OF SEMICONDUCTOR DEVICES
CHIPARRAY
CHIPARRAY
Trademark
Word
REGISTERED
Owner:
Serial:75105481
Filed:May 16, 1996
Classes:17
Registration:2159448
Registered:May 19, 1998
Description: Ceramic substrate or epoxy laminate substrate with copper circuit traces in encapsulated plastic for packaging semiconductor devices
SUPERBGA
SUPERBGA
Trademark
Word
CANCELLED
Owner:
Serial:74347349
Filed:Jan 11, 1993
Classes:9
Registration:1866256
Registered:Dec 6, 1994
Description: Electronic circuitry modules interconnecting a multiplicity of integrated circuit chips as a unit
POWERQUAD
POWERQUAD
Trademark
Word
CANCELLED
Owner:
Serial:74207880
Filed:Sep 30, 1991
Classes:9
Registration:1754474
Registered:Feb 23, 1993
Description: Electronic components and custom designed electronic components; namely, electronic and integrated circuit boards and semiconductors
AMKOR
AMKOR
Service Mark
Word
REGISTERED
Owner:
Serial:73327747
Filed:Sep 14, 1981
Classes:35
Registration:1241384
Registered:Jun 7, 1983
Description: Import and Export Agency Services in the Field of Electronic Components and Systems