POWERCSP
RegisteredWord Mark
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Ownership
AT
Address
Tempe, AZ 85284
Critical Dates
First Use Date
May 31, 2021
Filing Date
Jul 2, 2020
Registration Date
Nov 15, 2022
Mark Descriptions
Goods
Class 9
Class 009: Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects; Class 040: Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others; Class 042: Design and testing of semiconductor devices for others
Services
Class 40
Class 009: Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects; Class 040: Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others; Class 042: Design and testing of semiconductor devices for others
Class 42
Class 009: Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects; Class 040: Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others; Class 042: Design and testing of semiconductor devices for others
Mark Elements
Text Mark
POWERCSP
Category
Trademark
Standard Characters
No
Color Claim
No
Trademark Timeline
Filing Date
Publication Date
First Use
Registration Date
USPTO Records
No documents found for this trademark.