ATOTECH USA, INC.

Description: INDUSTRIAL ETCHING MACHINES

Description: Nickel plating; chemical preparations, namely, electroless nickel plating baths, for use in depositing nickel alloy onto metal substrates

Description: Modular conveyorized machines to perform chemical milling and printed circuit board fabrication processes, representative modules include load and unload modules, rinse modules, etch modules, strip modules, electroless plating modules, electroplating modules, drying modules, cleaning modules, scrubbing modules and deburring modules

Description: Solvent-type processing chemicals for use in the printed circuit industry

Description: Solvent-type processing chemicals for use in the printed circuit industry

Description: Chemical products used for the treatment or preparation of surfaces in the printed circuit board industry

Description: Chemical products used for the treatment or preparation of surfaces in the printed circuit board industry

Description: Solvent-type processing chemicals for use in the printed circuit industry

Description: Solvent-type processing chemicals for use in the printed circuit industry

Description: Chemical compounds, namely, dry film resist strippers and photo polymer resist strippers for use in the printed circuit board industry

Description: Educational services, namely, conducting technical seminars in the field of metal plating; "COLLEGE OF TECHNICAL TRAINING"

Description: Focused, self-adjusting air delivery equipment, specifically, self-adjusting air blowers for drying printed circuit boards

Description: Conveyors for use in cleaning populated printed circuit boards under nozzles which dispense cleaning and rinsing solutions

Description: Horizontal conveyorized, product transport, fluid delivery and drying equipment used to chemically process printed circuit boards and to chemically mill metal parts wherein the circuit boards or metal parts are conveyed sequentially through various chemical process chambers for cleaning, desmearing, metallization, resist-and solder stripping, developing, etching, coating and drying processes, wherein the boards or parts are sprayed or flooded with solutions of various chemicals and dried

Description: Chemicals used for the plating of non-precious metals, namely, for decorative and functional purposes and for the plating of printed circuit board substrates

Description: Tin based chemical used in oil field recovery, specifically an oil well treatment additive

Description: Machines for the chemical machinery of work pieces, the making of printed circuits and the making of printing surfaces and engravings by etching and/or wet processing treatment; namely, cleaning, etching, rinsing, drying, conveying, transporting, spraying, developing, stripping, heating, chemical washing, etchant regenerating, material handling, finishing, scrubbing, inputting and outputting machines and systems comprised of any of the aforesaid machines

Description: Conveyorized aqueous and semi-aqueous spray cleaning machines for production volume cleaning of industrial parts and components and of printed circuit assemblies and electronic parts and components

Description: Cleaning preparations, namely cleaners and post-processing cleaners for use in the electroplating of conductive metals onto printed circuit board substrates; chemicals, namely conditioners, pre-dip solutions, activator solutions and dispersions, immersion baths, neutralizing solutions, micro-etch solution, anti-tarnish solutions, all for use in the electroplating of conductive metals onto printed circuit board substrates

Description: Production machines for use in the printed circuit, photoengraving, photolithographic and wet processing industries; namely, electroplating machines, electroless plating machines, electrodeposition machines, etching machines, conveying machines, rinsing machines, drying machines, spraying machines, printed circuit board developing machines, stripping machines and parts of the aforesaid machines; "SERIES"

Description: Purified peptone solution for use in fluoborate electroplating solutions to provide grain refinement

Description: CHEMICALS, NAMELY ADDITION AGENTS FOR ALKALINE ZINC ELECTROPLATING BATHS

Description: BRIGHTENERS FOR BARREL NICKEL PLATING BATHS

Description: STANNOUS CHLORIDE

Description: APPARATUS FOR THE CHEMICAL MACHINING OF WORK PIECES, THE MAKING OF PRINTED CIRCUITS AND THE MAKING OF PRINTING SURFACES AND ENGRAVINGS BY AN ETCHING AND/OR WET PROCESSING TREATMENT COMPRISING SELF-CONTAINED INTERCONNECTING MODULES AND INDIVIDUAL MODULES THEREOF

Description: PRODUCTION AND LABORATORY EQUIPMENT FOR THE CHEMICAL MACHINING OF WORK PIECES AND THE MAKING OF PRINTED CIRCUITS-NAMELY, CONVEYORIZED ETCHERS; BENCH-TYPE ETCHERS; APPARATUS FOR RINSING WORK PIECES; NEUTRALIZING APPARATUS; STRIPPING APPARATUS; BRIGHTENING APPARATUS; ETCHANT REGENERATION APPARATUS; BATCH ETCHERS; SPRAY ETCHERS; DOUBLESIDED SPRAY ETCHERS; SINGLE-SIDED SPRAY ETCHERS; PRINTED CIRCUIT ETCHERS; RESIST REMOVERS; POST-CLEANING APPARATUS; DRIERS FOR ETCHING EQUIPMENT; DEVELOPERS; RESIST STRIPPERS; COMBINATION SPRAY RINSE AND RESIST STRIPPING APPARATUS; RE-EXPOSURE APPARATUS; BRUSH-RESIST REMOVERS; RINSING APPARATUS; COMBINATION BRIGHTENER, RINSE AND COATING APPARATUS; CONTROL APPARATUS; AND DELIVERY AND CIRCULATION PUMPS, AND PARTS AND PIECES FOR SUCH GOODS

Description: Chemical Tumbling Compounds and Materials in Dry Powder, Liquid, or Paste Form, for Use in Preparing the Surfaces of Metals Prior to Inspection, Electroplating, Painting, or Lacquering, Whether Coated or Uncoated, to Protect Such Surfaces from Wear, Corrosion, to Enhance the Appearance of the Product, Removing Contamination, and Various Types of Soil or to Obtain a More Brilliant Surface Appearance

Description: Machines for plating printed circuit boards

Description: CHEMICALS FOR USE IN THE PRODUCTION OF PRINTED WIRING BOARDS

Description: Cleaners, etchants and oxides for use in the printed circuit board industry

Description: Chemicals; namely, immersion baths, for use in the electroplating of conductive metals onto printed circuit board substrates and into holes therein

Description: Chemicals added to plating baths for bright nickel plating for use in the metal finishing industry

Description: CHEMICALS FOR USE IN CHROMIUM PLATING PROCESSES

Description: CHEMICALS USED FOR MAKING UP, AND REPLENISHING BATHS USED FOR COATING ALUMINUM WITH TIN, [ SUCH GOODS BEING FOUND ]

Description: Electroless Nickel Plating Addition Agents

Description: CHEMICAL COMPOSITION FOR ADDING BISMUTH TO TIN PLATING BATH

Description: CHEMICALS USEFUL FOR ELECTROPLATING TRIVALENT CHROMIUM, SAID CHEMICALS INCLUDING STABILIZERS, CHROME ADJUSTORS, REGULATORS, AND CORRECTORS

Description: BRIGHT NICKEL ELECTROPLATING BATH AND ADDITION AGENTS THEREFOR

Description: CHEMICAL COMPOSITION FOR SUPPRESSING MIST IN CHROMIUM PLATING BATHS AND ANODIZING BATHS

Description: CHROMIUM ELECTROPLATING BATHS AND CHEMICAL ADDITION AGENTS FOR USE IN CHROMIUM ELECTROPLATING BATHS

Description: CHEMICAL ADDITIVE TO ELECTROPLATING BATHS

Description: ADDITION AGENT FOR ELECTROPLATING SOLUTIONS

Description: CHEMICAL COMPOUNDS AND COMPOSITIONS IN DRY FORM FOR USE IN CHROMIUM PLATING BATHS AND ALSO IN THE FORM OF AQUEOUS SOLUTIONS

Description: SYNTHETIC RESINOUS MATERIAL IN THE FORM OF SOLUTIONS FOR USE TO FORM COATINGS ON ELECTRO-PLATING APPARATUS AND PARTS THEREOF, SUCH AS TANKS, CONTAINERS, RACKS, COILS, AND SHIELDS, COATED OR LINED WITH THE AFORESAID MATERIAL, RESISTANT TO THE ACTION OF CHROMIC ACID AND OTHER PLATING SOLUTIONS AND TO ACID AND ALKALI SOLUTIONS USED AS CLEANERS PREPARATORY TO PLATING, AND THINNERS FOR SOLUTIONS OF SAID MATERIAL