Semiconductor testing apparatus; probes for testing semiconductors; electric contacts and electric conductors, namely, test needles for testing semiconductors; Precious metals and their alloys; precious metal alloys for use in electronic technology; palladium alloys; precious metal alloys, other than for use in dentistry
Chemicals for industrial use; chemical preparations and materials, namely, metal ion containing inks for inkjet printing; industrial chemicals used in industry and science; chemical compositions for use in the manufacture of electronic components; chemical preparations for general industrial manufacturing having conductive properties; industrial chemicals, namely, printing chemicals; chemicals for use in the electronics industry; chemicals for use in printing industry; chemicals used for manufacturing, namely, for plating non-conducting surfaces with metals | Printing ink; printer paste; inks for printing, marking and engraving; ink jet printer ink; metallic inks; metallic printing inks; paints for electronic components; conductive paints; printing ink with electric conductivity; ultra violet light-cured printing inks | Industrial machines for printing and textile dyeing; Machines for manufacturing of electrostatic and electronic devices; inkjet printing machines; industrial inkjet printing machines; industrial printing machines; machines for the printing onto surfaces of materials for the preparation of electronic circuitry components, including transistors and other semi-conductor devices, the machines using the technique of inkjet printing | Apparatus and instruments for conducting, switching, transforming, storing, regulating and controlling the distribution and use of electricity; electrical devices in the form of electrical circuits and their controllers; integrated circuit modules; passive electronic circuits; printed electronic circuits; electrical and electronic components in the nature of capacitors, connectors, filters, oscillators, relays, switches, transformers, resistors, semiconductors, integrated circuits, rectifiers and transistors; electronic circuit boards; printed circuit boards; circuit boards provided with integrated circuits; electronic circuit cards; electronic logic circuits; electronic circuits; electronic control circuits; integrated circuits; integrated electronic circuits; printed electrical circuits | Electromagnetic interference shielding gaskets | Printing; printing services; digital printing; printing of electronic components for mobile phones; printing of electronic components for communication devices; custom 3D printing for others; 3D printing services for others; consulting in the field of inkjet printing of electronic circuitry | Scientific and technological services, namely, analysis and testing in the fields of inkjet printing of electronic circuitry, and the preparation of electronic circuitry using metallic inks, and research and design relating thereto; Product research and development for commercial electronic applications; chemical research; Development and establishment of testing specifications and procedures for the electronics, medical engineering and inkjet printing industries; industrial research in the fields of electronics, medical engineering and inkjet printing; technical consultancy relating to the use of materials for the preparation of electronic circuitry; technical consultancy in the design of machinery for electronic circuitry manufacture; chemistry consultation; product development consultation; component material testing; engineering research in the fields of electronics, medical engineering and inkjet printing; engineering services
Die-casting of metals; Metal casting; Custom manufacture of metal hardware; Metal pressing; Metal treating; Heat treatment of metals; Metal finishing for others; Metal melting services in the nature of treatment of metal; Metalworking; Metallurgical processing in the nature of treatment of metal; ; Recycling of metals; Glass powder for building purposes; Aluminum and its alloys; partly wrought common metals; Metals in foil or powder form for 3D printers; Cast iron unwrought or semi-wrought; Casting alloys; Building castings of metal; Building castings of metal alloys; Castings, foils, powder, and rolled, drawn or extruded semi-finished articles of aluminum or its alloys; Castings, foils, powder, and rolled, drawn or extruded semi-finished articles of copper or its alloys; Castings, foils, powder, and rolled, drawn or extruded semi-finished articles of nickel or its alloys; Alloys of metal containing calcium and aluminum; non-ferrous meals and their alloys; Non-ferrous metals and their alloys; Alloys of common metal; Metals in powder form for 3D printers; Alloys of metal; Common metals unwrought or semi-wrought; Titanium and its alloys; common metals, unwrought and semi-wrought for further manufacture; alloys of common metals, unwrought or semi-wrought; Common metals and their alloys including stainless steel; amorphous metals in the form of pastes containing metal-filled glass and an organic vehicle, carrier or matrix, for further processing in industry; Bulk metallic glass for use as structural elements in mechanical engineering; Bulk metallic glass for use as building materials in mechanical engineering; Iridium and its alloys; Alloys of precious metal; Palladium and its alloys; Ornaments of precious metal in the nature of jewelry; jewelry; Clocks; Alloys of rare earth metals; Medical apparatus and instruments for use in orthopedic surgery; medical apparatus and instruments for use in surgery; medical instruments for cutting tissue; surgical and medical apparatus and instruments for use in general surgery; surgical and medical apparatus and instruments for use in orthopedic surgery; medical and surgical apparatus and instruments, namely, orthopedic fixation device used in orthopedic transplant and implant surgery; Scientific laboratory services in the field of metallurgy; Engineering services; Scientific services, namely, scientific analysis in the field of metallurgy; Metallurgical analysis; Engineering services relating to metal forming systems
Chemicals for use in industry; adhesives for industrial use; chemicals in paste form containing metal powders for industrial use; conductive adhesives for industrial purposes
Generation of electricity; electricity generation from solar energy; Solar modules for electricity generation, namely, photovoltaic solar modules for production of electricity; solar wafer; solar cell plates; photovoltaic solar modules; electrical solar cells; crystalline silicon solar cells; solar panels for the production of electricity; solar cells for the generation of electricity; photovoltaic apparatus and installation for generating solar electricity, namely, photovoltaic solar panels for the production of electricity; photovoltaic modules; photovoltaic wire, namely, metal ribbon and uninsulated cooper ribbon for use in connecting solar cells to one another
Full and partial recycling of noble metals; treatment of noble metal samples for analysis; manufacturing services, namely, homogenization of noble metal containing material to the order and specification of others | Executing of chemical analyses, particularly from noble metal samples
Class 001: Chemicals for soldering of metals as part of electronic components; Class 006: Common metals and their alloys, namely tin alloys, lead alloys, copper and its alloys, German silver alloys and silver solder alloys for use in manufacturing electronic components; brazing alloys, namely, copper and its alloys, German silver alloys, silver solder alloys, nickel alloys, cobalt alloys and germanium alloys for use in manufacturing electronic components; soldering wire of metal for use in manufacturing electronic components; rods of metal for brazing for use in manufacturing electronic components; metals in powder form for use in manufacturing electronic components; common metals, unwrought or semi-wrought, namely, tin, lead, copper, German silver, silver solder, nickel, cobalt and germanium for use in manufacturing electronic components; Class 009: Integrated circuit chips; Class 014: Precious metals and their alloys for use in manufacturing electronic components; goods in precious metals or coated therewith in the form of sealing rings, ribbons, foils, wires, wire rings, disks, squares, frames and washers for use in manufacturing electronic components
Chemical agents for use in soldering in the microelectronics industry; electronic-grade chemical agents for use in soldering in the microelectronics industry; chemical agents for use in screen printing, dispensing and jetting in soldering in the microelectronics industry; chemical agents for use in soldering in the microelectronics industry, namely, in the semiconductor industry; chemical agents for use in soldering in the microelectronics industry, namely, chemical agents for use in clean room applications; all the aforementioned goods preferably for use in chip-production, namely, as soldering preparations comprising solder metal alloys and flux, conductive inks comprising solder metal and its alloys and flux for use in surface-mountable devices (SMD), surface-mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches and line spacing from 100 nanometers up to 200 micrometers, in particular wherein the particles of the powder have a particle size of less than 50 micrometers, in particular comprising the metals tin, copper, zinc, bismuth and silver and an alloy of at least of two of the metals; all the above mentioned goods preferably for use in chip-production, namely, electronic-grade chemical agents for use in soldering in the microelectronics industry for surface-mountable devices (SMD), surface-mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches and line spacing from 100 nanometers up to 200 micrometers, in particular wherein the particles of the powder have a particle size of less than 50 micrometers, in particular comprising the metals tin, copper, zinc, bismuth and silver and an alloy of at least of two of these metals; all of the above-mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and in the field of gas and water pipes | conductive inks for use in wave soldering, THT-soldering, also known as through-hole technology-soldering, and SMD-soldering, also known as surface mounted technology soldering, wherein the inks comprising solder metal and its alloys and flux for printing of electronic components, in particular in the chip industry, semiconductor industry, consumer electronics industry and automotive industry; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and not for soldering in the field of gas and water pipes | soldering pastes; soft solder for use in the form of a printable paste for use in microelectronic applications, wherein the paste comprises powder having a particle size of less than 50 micrometers of tin, copper, zinc and silver; solder pastes for use in wave soldering, THT-soldering, also known as through-hole technology-soldering, and SMD-soldering, also known as surface mounted technology soldering, wherein the pastes comprise solder metal and its alloys and flux for use in printing of electronic components, in particular in the chip industry, semiconductor industry, consumer electronic industry and automotive industry; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and not for soldering in the field of gas and water pipes | Lead-free solder, namely, tin comprising solder, for the microelectronics industry, in particular the microelectronics chip industry; all of the above-mentioned goods for use in chip production, namely, for use as soldering pastes comprising solder metal and/or its alloys and flux, conductive inks comprising solder metal and/or its alloys and flux for surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches or line space from 100 nanometers to 200 micrometers; all the above-mentioned goods for use in chip production, namely, for use in the production of surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuit boards with pitches or line space from 100 nanometers up to 200 micrometers; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry or iron-containing components, or in the field of gas and water pipes; all aforementioned goods for depositing, in particular by printing, underfill technologies for flip-chip (FC), and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), preferred according to Industry Specifications (IPC)
Sealing, packing and insulating material; material for electrical insulation; cements, in particular for use as electrical insulating compounds in electronics; all of the above for making electronic components; none of the above using activated carbon or activated carbon fiber; cements, in particular for use as coating compounds in electronics; cement fillers; all of the above for making electronic components; none of the above using activated carbon or activated carbon fiber
Electrical contact materials based on precious metals; Metal pastes, namely, solder pastes; solder pastes; conductive pastes, namely, solder paste; Precious metals, precious metal alloys, and precious metal compounds, in particular for connection technology; precious metals; precious metal alloys and precious metal compounds in the form of powders and pastes made from these powders used in manufacturing, all for use in manufacturing electrical and electronic components; precious metal compounds in the form of powders and pastes made from these powders used in manufacturing, all for further manufacturing, but not for use in painting, decorating, printing, art or in manufacturing jewelry; Chemicals for use in industry and science; chemical products for use in connection technology; chemical agents for hardening, soldering and sintering metals; adhesives for industrial purposes, conductive adhesives for industrial purposes; conductive pastes for industrial purposes for further use in the manufacture of electronic components
Electrical conductors, namely, metal paste for use in the manufacture of electronic devices; electric contact materials with a precious metal base for use in the manufacture of electronic devices, namely, electrical components in the nature of electric contactors; all the aforesaid goods made in significant part of silver; Metal pastes, namely, solder pastes; solder pastes; conductive pastes, namely, solder paste; all of the aforesaid goods made in significant part of silver; Precious metals, precious metal alloys, and precious metal compounds, in particular for connector systems; precious metals, precious metal alloys and precious metal compounds in the form of powders and pastes made from these powders used in manufacturing, all for use in manufacturing electrical and electronic components; precious metal compounds in the form of powders and pastes made from these powders used in manufacturing, all for further manufacturing, but not for use in painting, decorating, printing, art or in manufacturing jewelry; all of the aforesaid goods for use in manufacturing electrical and electronic components and made in significant part of silver; Chemicals for use in industry and science; chemicals used in connection and joining technology in the nature of chemicals for industrial purposes; Chemical agents for use in industry for hardening, soldering and sintering metals; adhesives for industrial purposes, conductive adhesives for industrial purposes; conductive chemical pastes for industrial purposes for connecting semi-conductor chips and electronic components to lead frames or boards; all of the aforesaid goods for industrial purposes and made in significant part of silver
Chemical preparations for use in industry; chemical preparations and materials for film, photography and printing; unprocessed plastics; adhesives for use in industry; chemical substances, chemical materials, and chemical preparations for general industrial manufacturing; salts for industrial purposes; unprocessed artificial and synthetic resins; chemical for use in electrophotography; unprocessed artificial conductive resins; materials for use as constituents of printing inks, namely, unprocessed synthetic conductive resins | Dyes for general industrial use; colorants; pigments; printing inks for general industrial use; printing pastes | Semi-worked synthetic plastics, namely, artificial conductive resins and conductive polymers as semi-finished products in the form of foils; semi-processed artificial resins, namely, artificial conductive resins, in the form of sheets for use in manufacture; semi-processed artificial conductive resins in the form of sheets for use in manufacture; materials for use as constituents of printing inks, namely, semi-processed synthetic conductive resins
Metal-ceramic composite materials, namely, copper-ceramic-copper composite materials; metal-ceramic substrates composed in significant part of copper, for use in the electronics industry
Metal-matrix composite materials, namely, substrates composed in significant part of copper, for use in the electronics industry; metal-ceramic substrates composed in significant part of copper, for use in the electronic industry
Metal-matrix composite materials, namely, substrates composed in significant part of copper, for use in the electronics industry; metal-ceramic substrates composed in significant part of copper, for use in the electronics industry
Chemicals used in industry, in particular for the production and processing of conductive materials; chemical products for electrophotography; artificial resins, namely, toner resins for electrophotography; unprocessed synthetic resins in the form of powder, paste, granules, liquids, emulsions; dispersions of conductive polymers in organic or inorganic solvents or water, all for use in further manufacture in a wide variety of industries; dispersions of 3,4-polyethylenedioxythiophen or polyaniline in organic or inorganic solvents or water, all for use in further manufacture in a wide variety of industries | Printing inks and printing pastes comprising conductive polymers and solvents or water; colored, colorless and transparent formulations of conductive polymers which are used for the coating of surfaces; printing inks and printing pastes comprising 3,4-polyethylenedioxythiophen or polyaniline and solvents or water; colored, colorless and transparent formulations of 3,4-polyethylenedioxythiophen or polyaniline which are used for the coating of surfaces | [ Luminaria for lighting purposes, namely, LED (light emitting diodes) displays which contain a coating of conductive polymers, 3,4-polyethylenedioxythiophen or polyaniline ] | [ Luminaria for lighting purposes, namely, LED (light emitting diodes) lighting fixtures which contain a coating of conductive polymers, 3,4-polyethylenedioxythiophen or polyaniline ] | [ Plastic materials for packaging, namely, plastic bags for packaging; plastic film not for commercial or industrial use, namely, plastic films for packaging ] | [ Plastics in extruded form for use in manufacture, namely, semi-processed plastic in the form of films; plastic films other than for packaging, namely, plastic film for commercial and industrial use ]
Metal powder, in particular base metal powder used in manufacturing; solder powder and soft solder for micro-electronic applications; brazing solder for micro-electronic applications; noble metal powder used in manufacturing
