SHOEI
REGISTERED AND RENEWEDStylized Mark
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Ownership
SC
Address
1-1 Nishi Shinjuku 2-chome
Shinjuku-ku, Tokyo, 163-0443
JP
Critical Dates
First Use Date
Jun 19, 1981
Filing Date
Mar 22, 1985
Registration Date
Nov 19, 1985
Mark Descriptions
Goods
Class 1
BONDING WIRES FOR SEMICONDUCTOR DEVICES; METAL POWDERS; CONDUCTIVE PASTES; RESISTIVE PASTES; DIELECTRIC PASTES; METAL OXIDES; METAL CATALYSTS; METAL SALTS; SOLDER PASTES; SOLDERING FLUXES; SURFACE-ACTIVE AGENTS; CONDUCTIVE ADHESIVES ALL FOR INDISTRIAL PURPOSES
Class 6
BONDING WIRES FOR SEMICONDUCTOR DEVICES; METAL POWDERS; CONDUCTIVE PASTES; RESISTIVE PASTES; DIELECTRIC PASTES; METAL OXIDES; METAL CATALYSTS; METAL SALTS; SOLDER PASTES; SOLDERING FLUXES; SURFACE-ACTIVE AGENTS; CONDUCTIVE ADHESIVES ALL FOR INDISTRIAL PURPOSES
Class 9
BONDING WIRES FOR SEMICONDUCTOR DEVICES; METAL POWDERS; CONDUCTIVE PASTES; RESISTIVE PASTES; DIELECTRIC PASTES; METAL OXIDES; METAL CATALYSTS; METAL SALTS; SOLDER PASTES; SOLDERING FLUXES; SURFACE-ACTIVE AGENTS; CONDUCTIVE ADHESIVES ALL FOR INDISTRIAL PURPOSES
Class 17
BONDING WIRES FOR SEMICONDUCTOR DEVICES; METAL POWDERS; CONDUCTIVE PASTES; RESISTIVE PASTES; DIELECTRIC PASTES; METAL OXIDES; METAL CATALYSTS; METAL SALTS; SOLDER PASTES; SOLDERING FLUXES; SURFACE-ACTIVE AGENTS; CONDUCTIVE ADHESIVES ALL FOR INDISTRIAL PURPOSES
Mark Elements
Text Mark
SHOEI
Category
Trademark
Standard Characters
No
Color Claim
No
Trademark Timeline
First Use
First Use in Commerce
Filing Date
Publication Date
Registration Date
USPTO Records
No documents found for this trademark.