BOND
RegisteredCombined Mark

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Address
First Use Date
Jul 1, 2003
Filing Date
Feb 16, 2018
Registration Date
Jul 3, 2018
Goods
The mark consists of THE LOWER CASE LETTERS "BOND", WITH THE STEM OF THE LETTER "D" FORMING AN ARCH OVER THE LETTERS "N" AND "D" AND BISECTING THE LETTER "O" AND WITH A SINGLE LEAF DESIGN APPEARING WITHIN THE LETTER "O".
No documents found for this trademark.