CHILLFLEX
PendingWord Mark
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Key Information
Ownership
TK
Address
2-4, Nakanoshima 3-chome, Kita-ku
Osaka, Tokyo, 530-0005
JP
Critical Dates
First Use Date
Not filed yet
Filing Date
May 16, 2024
Publication Date
Feb 11, 2025
Mark Descriptions
Goods
Class 9
heat dispersing sheets sold as part of electronic components of computers, semiconductors, and integrated circuits; heat dispersing sheets made from heat conductive insulating materials sold as part of electronic components for computers...
Class 17
heat dispersing sheets sold as part of electronic components of computers, semiconductors, and integrated circuits; heat dispersing sheets made from heat conductive insulating materials sold as part of electronic components for computers...
Mark Elements
Text Mark
CHILLFLEX
Category
Trademark
Standard Characters
No
Color Claim
No
Pseudo Mark
CHILL FLEX
Trademark Timeline
Filing Date
Publication Date
USPTO Records
No documents found for this trademark.