2.5D CUBE-S
PendingWord Mark
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Key Information
Ownership
SE
Address
129, Samsung-ro, Yeongtong-gu, Suwon-si,
Gyeonggi-do, 16677
KR
Critical Dates
First Use Date
Not filed yet
Filing Date
Feb 10, 2026
Publication Date
Oct 13, 2026
Mark Descriptions
Goods
Class 9
Class 009: Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging...
Services
Class 40
Class 009: Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging...
Class 42
Class 009: Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging...
Mark Elements
Text Mark
2.5D CUBE-S
Category
Trademark
Standard Characters
No
Color Claim
No
Disclaimer
2.5D
Pseudo Mark
TWO POINT FIVE D CUBE S · TWO POINT FIVE DIMENSIONAL CUBE S · TWO AND A HALF D CUBES · TWO AND A HALF D CUBE S · TWO POINT FIVE D CUBES · TWO AND A HALF DIMENSIONAL CUBES · TWO AND A HALF DIMENSIONAL CUBE S · TWO POINT FIVE DIMENSIONAL CUBES · TWO DOT FIVED CUBES
Trademark Timeline
Filing Date
Publication Date
USPTO Records
No documents found for this trademark.