SAMSUNG 2.3D CUBE-E
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Key Information
Serial Number
Registration Number
Not Registered
Status
New Application Awaiting Assignment to an Examining Attorney. See Current Trademark Processing Wait Times for More Information.
Ownership
SE
Address
Gyeonggi-do, 16677
KR
Critical Dates
First Use Date
Not filed yet
Filing Date
Feb 10, 2026
Publication Date
Not published yet
Mark Descriptions
Goods
Class 9
Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging...
Services
Class 40
Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging...
Class 42
Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging...
Mark Elements
Text Mark
SAMSUNG 2.3D CUBE-E
Category
Trademark
Standard Characters
Yes
Color Claim
No
Related Registrations
2882774
2929519
2929523
Trademark Timeline
Filing Date
USPTO Records
No documents found for this trademark.